Manufacturing capabilities
Technical capabilities for PCB and PCBA manufacturing
Aulink documents its fabrication tolerances, layer counts, and SMT assembly capacity so engineers can verify board requirements before sending an inquiry. Parameters below reflect our standard production scope.
Production workflow
From design review to final test
Each board moves through a controlled sequence of design-for-manufacturing review, fabrication, SMT placement, automated optical inspection, and final testing.
DFM review
Layer stack, trace width, and drill sizes are checked against the fabrication rules before release.
Fabrication
Etching, plating, and lamination follow the approved stack-up for rigid, flexible, and HDI boards.
SMT placement
Automated pick-and-place lines populate passives through multi-pin IC packages.
AOI and test
Automated optical inspection, flying probe testing, and X-ray analysis validate each lot.
Technical parameters
Tolerances for high-density boards
Etching and spacing
Minimum trace and space supports high-density interconnects and tight line spacing, with plating controlled to the approved stack-up.
Holes and aspect ratio
Hole aspect ratios and surface finishes are specified per board, with drilling and plating matched to the layer count.
Component handling
SMT lines handle miniature passives through large multi-pin IC packages, with package handling reviewed against the bill of materials.