Bare boards and populated assemblies, one manufacturing scope

From quick-turn PCB prototypes to multilayer, rigid, flexible FPC and HDI boards, plus turn-key SMT assembly. Share your Gerber files and we will direct your inquiry to the right line.

Quick-turn runs for design validation before volume production. Suited to first-article checks, firmware bring-up and fit testing across common board sizes and finishes.

Stackups from four layers upward for dense routing, power distribution and controlled impedance. Layer count, copper weight and material are confirmed against the design during quoting.

Standard FR-4 and specialty rigid boards for industrial controllers, power modules and instrumentation. Thickness, surface finish and solder mask are specified in your inquiry.

Flexible printed circuits for bends, tight enclosures and interconnects. Polyimide base with coverlay options, supplied as single-sided, double-sided or multilayer constructions.

High-density interconnect boards with microvias and fine lines for compact, high-pin-count designs. Build-up stackup and via structure are reviewed against your layout before production.

Turn-key and consigned surface-mount assembly, including fine-pitch and BGA placement and through-hole soldering. Component sourcing terms and test requirements are agreed with you per project.

A complete quote package speeds review. Include Gerber files in standard formats, the drill chart, and the intended stackup with layer count, copper weight, board thickness and surface finish.

For assembly, supply the bill of materials with reference designators, component values and package types. Specify whether components are consigned or sourced by Aulink, and list any test or inspection requirements.